Dengke Yuan, Deyu Zhang
Silicon carbide ceramics are the typical hard and brittle material, and widely used in high-performance components such as high-temperature bearings, high-temperature corrosion-resistant parts, and electronic devices due to their excellent properties, including high hardness, high thermal conductivity, and good wear resistance.In this study, in order to investigate the effects of different process parameters of the grinding forces of silicon carbide ceramics, the longitudinal-torsional ultrasonic grinding force model was established based on the longitudinal-torsional ultrasonic cutting model. Furthermore, the grinding force experimentsof silicon carbide ceramics were conducted by longitudinal-torsional ultrasonic vibration.The experimental results showed that, compared to conventional grinding, the grinding forces were significantly reduced by the introduction of longitudinal-torsional ultrasonic vibration. The normal force was reduced by up to approximately 15.1%, and the tangential force was reduced by up to approximately 14.2%.In addition, it was found that the grinding forces were decreased with the increaseof wheel speed and ultrasonic amplitudeunder longitudinal-torsional ultrasonic vibration, andwere increased with the increase of grinding depth, wheel grit size, and feed rate.
Silicon Carbide Ceramics; Grinding Force; Grinding Process; Longitudinal-Torsional Ultrasonic Vibration